For applications that can not be covered with standard heat sinks (die casting or extrusion) because of very high power loss or power density , we offer alternative heat sink solutions. For manufacturing technology limits for extruded profiles like fin spacing, a bonding technology is used for our HighPower heat sinks. The surface of the heat sink is increased by a higher number of Finns by keeping the same size of the base plate. Alternatively, we also realize heat sink solutions with graphite fins. Graphite has a thermal conductivity of 370 W / mK, equal to copper, but 75% lighter than copper, even 25% lighter than aluminum.