Die cut Thermal Interface Pads for CoB (Chip-on-Board) LEDs available on sheets or on rolls. Samples available from stock.
HT-1200: 608 mm
HT-2500: 304 mm
NEU HITHERMTM HT-C3200
HITHERMTM HT-C3200 for Power Modules
Consistent, reliable thermal performance enabling zero maintenance applications. Assembly-ready foil form factor eliminates dispensing and cleaning processes
-40°C bis 400 °C
Mega Power Dual MPD2
1 - 5
Thermal Impedance [°C.cm2 / Watt]
© 2015 GrafTech International Holdings Inc. This information is based on data believed to be reliable but GrafTech makes no warranties, express or implied, as to its accuracy and assumes no liability arising out of
its use. The data listed falls within the normal range of product properties but should not be used to establish speci¿cation limits or used alone as the basis of design. GrafTech’s liability to purchasers is expressly
limited to the terms and conditions of sale. eGRAF®, SPREADERSHIELDTM and HITHERMTM are trademarks of GrafTech International Holdings Inc. eGRAF® thermal management products, materials, and
processes are covered by several US patents.